Rumors of the upcoming iPhone 7 have already started to pour in as we get closer to Apple’s September event where the new model is expected to be unveiled. In a new leak released today, Japanese magazine Mac Fan shows an alleged design schematics of Apple’s upcoming iPhone 7 Plus model, which they refer to as the ‘iPhone 7 Pro’.

According to the leak, the new device will have the same dimensions as the iPhone 6s Plus, feature a dual-lens camera and will see the removal of the 3.5mm headphone jack.

What’s more interesting is that previous rumors suggested that Apple would adopt a thinner design for its upcoming flagship model by getting rid of the 3.5mm headphone jack, but Mac Fan reports that the same dimensions will be used as the iPhone 6s Plus. The design schematics suggest that the ‘iPhone 7 Pro’ will be 7.3mm thick, which is slightly thicker than the iPhone 6 Plus but same as the iPhone 6s Plus. Moreover, it will be 158.22 mm wide, 77.94 mm tall and 6.3 mm deep.

The magazine also claims that a new dual-lens camera will be added which might be available exclusively for the iPhone 7 Plus/ iPhone 7 Pro. The extra lens is expected to provide better camera shots in low-light environment. Additional information about the camera hasn’t been provided but it could also be the reason why the device will adopt the same thickness.

A Smart Connector port can also be seen in the design schematics on the rear shell, which reaffirms earlier rumors that the headphone jack will be removed. The extra space is speculated to be used for an additional speaker, but the drawing only shows one speaker.

Today’s leak is in line with previous rumors about the upcoming iPhone, but we shouldn’t take it for granted. The iPhone 7 and iPhone 7 Pro is expected to be announced by Apple in September this year and will likely come with an A10 processor and a redesigned home button.

Source: Mac Fan (Google Translation) via Mac Otakara (Google Translation)

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